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Intel DG33BU User Manual

Intel DG33BU
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Product Description
25
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 15
1.10.2 Audio Connectors and Headers
The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in Figure 4.
Item Description
A Line in
B Line out
C Mic in
Figure 4. Back Panel Audio Connector Options
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The location of the front panel audio header Figure 10, page 42
The signal names of the front panel audio header Table 16, page 45
The back panel audio connectors Section 2.2.1, page 41

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Intel DG33BU Specifications

General IconGeneral
Form FactorATX
ChipsetIntel G33
SocketLGA 775
Memory TypeDDR2
Maximum Memory8 GB
Memory Slots4
Supported CPUIntel Core 2 Quad, Core 2 Duo, Pentium, Celeron
Expansion Slots1 x PCI Express x16, 3 x PCI
USB Ports8 x USB 2.0
AudioRealtek ALC888 HD Audio
LANIntel 82566DC Gigabit Ethernet
Video OutputsVGA
Memory StandardDDR2 667/800
SATA Ports4 x SATA 3Gb/s

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