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Processor Thermal/Mechanical Information

Thermal and Mechanical Design Guidelines 15

2 Processor Thermal/Mechanical

Information

2.1 Mechanical Requirements

2.1.1 Processor Package

The processors covered in the document are packaged in a 775-Land LGA package

that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet

for detailed mechanical specifications.

The processor connects to the motherboard through a land grid array (LGA) surface

mount socket. The socket contains 775 contacts arrayed about a cavity in the center

of the socket with solder balls for surface mounting to the motherboard. The socket is

named LGA775 socket. A description of the socket is in the LGA775 Socket Mechanical

Design Guide.

The package includes an integrated heat spreader (IHS) that is shown in Figure 2-1

for illustration only. Refer to the processor datasheet for further information. In case

of conflict, the package dimensions in the processor datasheet supersedes dimensions

provided in this document.

Figure 2-1. Package IHS Load Areas

Top Surface of IHS

to install a heatsink

IHS Step

to inte rface w ith LGA775

Socket Load Plate

Substrate