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General| Processor Family | Intel Celeron D |
|---|---|
| Architecture | NetBurst |
| Number of Cores | 1 |
| Socket | LGA 775 |
| FSB Speed | 533 MHz |
| Operating Voltage | 1.25V-1.4V |
| Virtualization Technology | No |
| Integrated Graphics | No |
| Core Name | Prescott |
| Core Stepping | D0 |
| Clock Speed | 3.6 GHz |
| L1 Cache | 16 KB |
| Process Technology | 90 nm |
| Instruction Set | SSE, SSE2, SSE3 |
| L2 Cache | 256 KB - 512 KB |
Ensures components operate within their functional temperature range for optimal performance and prevents damage.
Describes general guidelines and requirements for attaching a heatsink to the processor package.
Covers key parameters for heatsink design: surface area, conduction path, and heat transfer.
Defines thermal characterization parameters (Psi) to evaluate thermal solution performance.
Provides guidelines for accurately measuring local ambient temperature around the processor.
Describes procedures for accurately measuring processor case temperature (Tc) on the IHS.
Details the on-die thermal management features: PROCHOT#, TCC, and registers.
Covers enabling, configuring, and monitoring the Thermal Control Circuit (TCC).
Explains the interaction of thermal diode, TCONTROL, and thermal profile for fan speed control.
Discusses heatsink clip load for mechanical performance and thermal interface.
Provides step-by-step instructions for conditioning and attaching a thermocouple to the IHS.
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