Intel Celeron D User Manual

Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide31
Order #303730
Intel Enabled Thermal Solutions
5.2 ATX Form Factor
Intel is enabling the following active thermal solutions for the Celeron D Processor in the 775-land
LGA package for Embedded Applications in the ATX, similar, or larger form factors.
These solutions have been tested in environments with a T
LA
up to 38° C. However, system-level
thermal solution verification should be performed in the final intended use.
5.3 1U Form Factor
Thermal solution design for the 1U form factor is challenging. Due to limited volume for the
heatsink, mainly in the direction of heatsink height, and the available amount of airflow, system
designers may have to make trade-offs in the system boundary condition requirements (i.e.,
Figure 8. Thermal Characterization Parameters for Various Operating Conditions
Table 5. Enabled Thermal Solutions
Heatsink Manufacturer Intel Part Number
Sanyo-Denki* C25697-001
Nidec* C25704-002

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB