Intel Celeron D User Manual

52 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Case Temperature Reference Methodology
7. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the
thermocouple in the channel ensuring the tip is in contact with the end of the channel grooved
in the IHS (Figure 24 and Figure 25).
8. Place the TTV under the microscope unit (similar to the one used in Figure 29) to continue
with process. It is also recommended to use a fixture (like processor tray or a plate) to help
holding the unit in place for the rest of the attach process.
9. Press the wire down about 6mm [0.125"] from the thermocouple bead using the tweezers.
Look in the microscope to perform this task. Place a piece of Kapton* tape to hold the wire
inside the groove (Figure 26). Refer to Figure 27 for detailed bead placement.
Figure 24. Thermocouple Bead Placement (View 1)
Figure 25. Thermocouple Bead Placement (View 2)

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB