Intel Celeron D User Manual

Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide 3
Order #303730
Contents
Contents
1.0 Introduction....................................................................................................................................6
1.1 Document Goals and Scope.................................................................................................6
1.1.1 Importance of Thermal Management.......................................................................6
1.1.2 Document Goals......................................................................................................6
1.1.3 Document Scope .....................................................................................................6
1.2 References ...........................................................................................................................7
1.3 Terms and Definitions...........................................................................................................7
2.0 Processor Thermal/Mechanical Information...............................................................................9
2.1 Mechanical Requirements ....................................................................................................9
2.1.1 Processor Package..................................................................................................9
2.1.2 Heatsink Attach......................................................................................................10
2.1.2.1 General Guidelines ................................................................................10
2.1.2.2 Heatsink Clip Load Requirement ...........................................................11
2.1.2.3 Additional Guidelines .............................................................................11
2.2 Thermal Requirements .......................................................................................................11
2.2.1 Processor Case Temperature and Power Dissipation...........................................12
2.2.2 Thermal Profile ......................................................................................................12
2.2.3 T
CONTROL
...............................................................................................................13
2.3 Heatsink Design Considerations.........................................................................................14
2.3.1 Heatsink Size.........................................................................................................15
2.3.2 Heatsink Mass .......................................................................................................15
2.3.3 Package IHS Flatness ...........................................................................................15
2.3.4 Thermal Interface Material.....................................................................................16
2.3.5 Summary ...............................................................................................................16
2.4 System Thermal Solution Considerations...........................................................................16
2.4.1 Improving Chassis Thermal Performance..............................................................16
3.0 Thermal Metrology ......................................................................................................................18
3.1 Characterizing Cooling Performance Requirements ..........................................................18
3.1.1 Example.................................................................................................................19
3.2 Processor Thermal Solution Performance Assessment .....................................................20
3.3 Local Ambient Temperature Measurement Guidelines ......................................................20
3.3.1 Measuring Active Heatsinks ..................................................................................20
3.3.2 Measuring Passive Heatsinks................................................................................21
3.4 Processor Case Temperature Measurement Guidelines....................................................22
4.0 Thermal Management Logic and Thermal Monitor ..................................................................23
4.1 Processor Power Dissipation..............................................................................................23
4.2 Thermal Monitor Implementation........................................................................................23
4.2.1 PROCHOT# Signal................................................................................................23
4.2.2 Thermal Control Circuit..........................................................................................24
4.2.3 Operation and Configuration..................................................................................25
4.2.4 On-Demand Mode .................................................................................................25
4.2.5 System Considerations..........................................................................................26
4.2.6 Operating System and Application Software Considerations ................................26
4.2.7 On-Die Thermal Diode...........................................................................................26

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB