Intel Celeron D User Manual

4 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Contents
4.2.7.1 Reading the On-Die Thermal Diode Interface........................................27
4.2.7.2 Correction Factors for the On-Die Thermal Diode .................................27
4.2.8 THERMTRIP# Signal.............................................................................................28
4.2.8.1 Cooling System Failure Warning ...........................................................28
4.2.9 How On-Die Thermal Diode, TCONTROL and Thermal Profile Work Together....29
4.2.9.1 On-Die Thermal Diode Less than TCONTROL......................................29
4.2.9.2 On-Die Thermal Diode Greater than TCONTROL.................................29
4.3 Acoustic Fan Speed Control...............................................................................................29
5.0 Intel Enabled Thermal Solutions................................................................................................30
5.1 Thermal Solution Requirements.........................................................................................30
5.2 ATX Form Factor ................................................................................................................31
5.3 1U Form Factor...................................................................................................................31
5.4 2U Form Factor...................................................................................................................33
5.5 Reference Thermal Mechanical Solution............................................................................35
6.0 Conclusion...................................................................................................................................36
A LGA775 Socket Heatsink Loading .............................................................................................37
B Heatsink Clip Load Metrology....................................................................................................42
C Thermal Interface Management..................................................................................................46
D Case Temperature Reference Methodology .............................................................................47
E Board Level PWM and Fan Speed Control Requirements.......................................................57
F Mechanical Drawings..................................................................................................................58
G Vendor Information .....................................................................................................................64
Figures
1 Package IHS Load Areas .............................................................................................................9
2 Processor Case Temperature Measurement Location...............................................................12
3 Example Thermal Profile ............................................................................................................13
4 Processor Thermal Characterization Parameter Relationships..................................................19
5 Measuring T
LA
— Active Heatsink...............................................................................................21
6 Measuring T
LA
— Passive Heatsink............................................................................................22
7 Concept for Clocks under Thermal Monitor Control ...................................................................24
8 Thermal Characterization Parameters for Various Operating Conditions ..................................31
9 1U Copper Heatsink ...................................................................................................................32
10 1U Thermal Solution Z-Height Constraints.................................................................................33
11 2U Copper Heatsink ...................................................................................................................33
12 Case-to-Ambient Thermal Characterization Parameter Ψ
CA
(°C/W)..........................................34
13 2U Height Restrictions................................................................................................................35
14 Board Deflection Definition.........................................................................................................38
15 Example: Defining Heatsink Preload Meeting Board Deflection Limit ........................................40
16 Load Cell Installation in Machined Heatsink Base Pocket – Bottom View .................................43
17 Load Cell Installation in Machined Heatsink Base Pocket – Side View......................................43
18 Preload Test Configuration.........................................................................................................44

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB