Intel Celeron D User Manual

Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide 5
Order #303730
Contents
19 FC-LGA4 Package Reference Groove Drawing.........................................................................49
20 IHS Reference Groove on the FC-LGA4 Package .....................................................................50
21 IHS Groove Orientation Relative to the LGA775 Socket ............................................................50
22 Bending the Tip of the Thermocouple.........................................................................................51
23 Securing Thermocouple Wires with Kapton* Tape Prior to Attach .............................................51
24 Thermocouple Bead Placement (View 1) ...................................................................................52
25 Thermocouple Bead Placement (View 2) ...................................................................................52
26 Position Bead on Groove Step ...................................................................................................53
27 Detailed Thermocouple Bead Placement ...................................................................................53
28 Using 3D Micromanipulator to Secure Bead Location................................................................54
29 Measuring Resistance between Thermocouple and IHS............................................................54
30 Applying the Adhesive on the Thermocouple Bead....................................................................55
31 Thermocouple Wire Management in the Groove........................................................................55
32 Removing Excess Adhesive from IHS........................................................................................56
33 Filling the Groove with Adhesive ................................................................................................56
34 ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions
for Enabling Components, Sheet 1.............................................................................................59
35 ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions
for Enabling Components, Sheet 2.............................................................................................60
36 ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions
for Enabling Components, Sheet 3.............................................................................................61
37 1U/2U Motherboard Component Keep-In Definition, Primary Side ............................................62
38 1U/2U Motherboard Component Keep-In Definition, Secondary Side........................................63
Tables
1 Reference Documents..................................................................................................................7
2 Terms and Definitions...................................................................................................................7
3 Thermal Diode Interface .............................................................................................................27
4 Thermal Characterization Parameter at Various TLA Levels .....................................................30
5 Enabled Thermal Solutions.........................................................................................................31
6 Board Deflection Configuration Definitions.................................................................................38
7 Typical Test Equipment ..............................................................................................................44
8 Definitions...................................................................................................................................47
9 Supporting Test Equipment ........................................................................................................47
10 Mechanical Drawings..................................................................................................................58
11 Intel Reference Component Thermal Solution Provider .............................................................64
Revision History
Date Revision Description
July 2005 002 Updated Table 1 and Table 4.
September 2004 001 Changes to branding. First public release.

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB