Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide55
Order #303730
Case Temperature Reference Methodology
13. Measure the resistance from the thermocouple end wires again using the DMM to ensure the
bead is still properly contacting the IHS.
D.15.3 Curing Process
1. Let the thermocouple attach set in the open-air for at least half an hour. It is not recommended
to use any curing accelerator for this step, as rapid contraction of the adhesive during curing
may weaken bead attach on the IHS.
2. Reconfirm electrical connectivity with DMM before removing the micromanipulator.
3. Remove the 3D Arm needle by holding down the TTV unit and lifting the arm.
4. Remove the Kapton* tape, straighten the wire in the groove so it lays flat all the way to the end
of the groove (Figure 31).
Figure 30. Applying the Adhesive on the Thermocouple Bead
Figure 31. Thermocouple Wire Management in the Groove
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