Intel Celeron D User Manual

54 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Case Temperature Reference Methodology
11. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the
IHS surface. This should be the same value as measured during the thermocouple conditioning
step (Figure 29).
12. Place a small amount of Loctite* 498 adhesive in the groove where the bead is installed. Using
a fine point device, spread the adhesive in the groove around the needle, the thermocouple
bead and the thermocouple wires already installed in the groove during Step 5 above. Be
careful not to move the thermocouple bead during this step (Figure 30).
Figure 28. Using 3D Micromanipulator to Secure Bead Location
Figure 29. Measuring Resistance between Thermocouple and IHS

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB