Intel Celeron D User Manual

54 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Case Temperature Reference Methodology
11. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the
IHS surface. This should be the same value as measured during the thermocouple conditioning
step (Figure 29).
12. Place a small amount of Loctite* 498 adhesive in the groove where the bead is installed. Using
a fine point device, spread the adhesive in the groove around the needle, the thermocouple
bead and the thermocouple wires already installed in the groove during Step 5 above. Be
careful not to move the thermocouple bead during this step (Figure 30).
Figure 28. Using 3D Micromanipulator to Secure Bead Location
Figure 29. Measuring Resistance between Thermocouple and IHS

Intel Celeron D Specifications

General

Brand	Intel
Model	Celeron D
Category	Computer Hardware
Language	English