Intel Celeron D User Manual

34 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Intel Enabled Thermal Solutions
Developers of thermal solutions for the Celeron D processor in the 775-land LGA package must
ensure that the solution meets the processor thermal specifications as stated in the processor
datasheet and follow the recommended motherboard component keep-out as shown in Figure 37
and Figure 38. This keep-out will ensure that the processor thermal solution will not interfere with
the voltage regulator components. In addition to this, a thermal solution design must meet the
maximum component heights as specified by the 2U Thin Electronics Bay Specifications located at
http://www.ssiforum.org. Figure 13 illustrates the Z-height constraints of the 2U form factor as
outlined in the specification.
Figure 12. Case-to-Ambient Thermal Characterization Parameter Ψ
CA
(°C/W)

Intel Celeron D Specifications

General

Brand	Intel
Model	Celeron D
Category	Computer Hardware
Language	English