Name: Intel Celeron D
Brand: Intel
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34 Intel

Celeron

D Processor in the 775-Land LGA Package Thermal Design Guide

Order #303730

Intel Enabled Thermal Solutions

Developers of thermal solutions for the Celeron D processor in the 775-land LGA package must

ensure that the solution meets the processor thermal specifications as stated in the processor

datasheet and follow the recommended motherboard component keep-out as shown in Figure 37

and Figure 38. This keep-out will ensure that the processor thermal solution will not interfere with

the voltage regulator components. In addition to this, a thermal solution design must meet the

maximum component heights as specified by the 2U Thin Electronics Bay Specifications located at

http://www.ssiforum.org. Figure 13 illustrates the Z-height constraints of the 2U form factor as

outlined in the specification.

Figure 12. Case-to-Ambient Thermal Characterization Parameter Ψ

(°C/W)

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Intel Celeron D Specifications

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