Intel Celeron D User Manual

Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide47
Order #303730
Case Temperature Reference Methodology
Appendix D Case Temperature Reference
Methodology
D.10 Objective and Scope
This appendix defines a reference procedure for attaching a thermocouple to the IHS of an
FC-LGA4 processor package for T
C
measurement. This procedure takes into account the specific
features of the FC-LGA4 package and of the LGA775 socket for which it is intended.
It describes the recommended equipment for the reference thermocouple installation, including
tools and adhesive part numbers.
D.11 Definitions
Definitions of common acronyms used in this appendix are given in the table below:
D.12 Supporting Test Equipment
To apply the reference thermocouple attach procedure, it is recommended to use the equipment (or
equivalent) given in the table below.
Table 8. Definitions
Term Definition
TTV Thermal Test Vehicle
IPA Isopropyl Alcohol
DMM Digital Multi Meter
IHS Integrated Heat Spreader
Table 9. Supporting Test Equipment (Sheet 1 of 2)
Item Description Part Number
Measurement and Output
Microscope Olympus* Light microscope or equivalent SZ-40
DMM Digital Multi Meter for resistance measurement Not Available
Test Fixture(s
)
Micromanipulator
(See Note below)
Micromanipulator set from YOU* Ltd. or equivalent.
Mechanical 3D arm with needle (not included) to maintain TC
bead location during the attach process.
YOU-3
Miscellaneous Hardware
Loctite* 498 Adhesive Super glue w/thermal characteristics 49850
Adhesive Accelerator Loctite* 7452 for fast glue curing 18490
Kapton* Tape For holding thermocouple in place Not Available

Intel Celeron D Specifications

General

Brand	Intel
Model	Celeron D
Category	Computer Hardware
Language	English