Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide29
Order #303730
Thermal Management Logic and Thermal Monitor
4.2.9 How On-Die Thermal Diode, T
CONTROL
and Thermal Profile Work
Together
The Celeron D Processor in the 775-land LGA package thermal specification is comprised of two
parameters, T
CONTROL
and Thermal Profile. The first step is to ensure the thermal solution by design
meets the thermal profile. If the system design will incorporate variable speed fan control Intel
recommends monitoring the on-die thermal diode to implement acoustic fan speed control. The
value of on-die thermal diode temperature determines which specification must be met.
4.2.9.1 On-Die Thermal Diode Less than T
CONTROL
If the thermal solution can maintain the thermal diode temperature to less than T
CONTROL
, then T
C
is
not specified.
4.2.9.2 On-Die Thermal Diode Greater than T
CONTROL
If the on-die thermal diode temperature exceeds T
CONTROL
, then the thermal solution must meet the
thermal profile for T
C
for that power dissipation.
4.3 Acoustic Fan Speed Control
For information on acoustic fan speed control see the Intel
®
Pentium
®
4 Processor on 90 nm
Process in the 775-Land LGA Package Thermal Design Guidelines.
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