38 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
LGA775 Socket Heatsink Loading
This board deflection metric provides guidance for mechanical designs that differ from the
reference design for ATX/µATX form factor.
A.2.2 Board Deflection Metric Definition
Board deflection is measured along either diagonal (refer to Figure 14):
d = dmax – (d1 + d2)/2
d’ = dmax – (d’1 + d’2)/2
Configurations in which the deflection is measured are defined in Table 6.
To measure board deflection, follow industry-standard procedures such as IPC for board deflection
measurement. Height gauges and possibly dial gauges may also be used.
Table 6. Board Deflection Configuration Definitions
Configuration
Parameter
Processor + Socket
load plate
Heatsink Parameter Name
d_ref Yes No Beginning of Life (BOL) deflection, no preload
d_BOL Yes Yes BOL deflection with preload
d_EOL Yes Yes End of Life (EOL) deflection
Figure 14. Board Deflection Definition
d1
d2
d’1
d’2