Intel Celeron D User Manual

38 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
LGA775 Socket Heatsink Loading
This board deflection metric provides guidance for mechanical designs that differ from the
reference design for ATX/µATX form factor.
A.2.2 Board Deflection Metric Definition
Board deflection is measured along either diagonal (refer to Figure 14):
d = dmax – (d1 + d2)/2
d’ = dmax – (d’1 + d’2)/2
Configurations in which the deflection is measured are defined in Table 6.
To measure board deflection, follow industry-standard procedures such as IPC for board deflection
measurement. Height gauges and possibly dial gauges may also be used.
Table 6. Board Deflection Configuration Definitions
Configuration
Parameter
Processor + Socket
load plate
Heatsink Parameter Name
d_ref Yes No Beginning of Life (BOL) deflection, no preload
d_BOL Yes Yes BOL deflection with preload
d_EOL Yes Yes End of Life (EOL) deflection
Figure 14. Board Deflection Definition
d1
d2
d’1
d’2

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB