Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide33
Order #303730
Intel Enabled Thermal Solutions
5.4 2U Form Factor
Intel has developed a reference thermal solution design for the Celeron D processor in the 775-land
LGA package for the 2U form factor. This design was optimized for the 2U form factor within the
available volume for the thermal solution. The motherboard component keep-outs can be seen in
Figure 37, “1U/2U Motherboard Component Keep-In Definition, Primary Side” on page 62 and
Figure 38, “1U/2U Motherboard Component Keep-In Definition, Secondary Side” on page 63.
This solution requires 100% of the airflow to be ducted through the heatsink fins in order to
prevent heatsink bypass. It is a copper base and copper fin heatsink that is attached to the
motherboard with the use of a backplate. This solution is shown in Figure 11.
The performance of this thermal solution at multiple airflow rates is shown in Figure 12. The
performance test data shown in the chart was collected to ensure that the thermal solution is
performing within expectations. This data implies no statistical significance. The final intended
thermal solution including, heatsink, airflow source, TIM, and attach mechanism must be validated
by system integrators. This heatsink solution uses the Shin-Etsu* G751 as the TIM.
Figure 10. 1U Thermal Solution Z-Height Constraints
Figure 11. 2U Copper Heatsink
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