Intel Celeron D User Manual

56 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Case Temperature Reference Methodology
5. Using a blade to shave excess adhesive above the IHS surface (Figure 32).
Note: Take usual precautions when using open blades.
6. Install new Kapton* tape to hold the thermocouple wire down and fill the rest of groove with
adhesive (See Figure 33). Make sure the wire and insulation is entirely within the groove and
below the IHS surface.
7. Curing time for the rest of the adhesive in the groove can be reduced using Loctite*
Accelerator 7452.
8. Repeat Step 5 to remove any access adhesive to ensure flat IHS for proper mechanical contact
to the heatsink surface.
Figure 32. Removing Excess Adhesive from IHS
Figure 33. Filling the Groove with Adhesive
Kapton* Tape
Filling with
Adhesive

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB