Intel Celeron D User Manual

50 Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Case Temperature Reference Methodology
The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner of
the package) is shown. Figure 20 for the FC-LGA4 package IHS.
When the processor is installed in the LGA775 socket, the groove is perpendicular to the socket
load lever, and on the opposite side of the lever, as shown Figure 21.
Select a machine shop that is capable of holding drawing specified tolerances. IHS channel
geometry is critical for repeatable placement of the thermocouple bead, ensuring precise thermal
measurements. The specified dimensions minimize the impact of the groove on the IHS under the
socket load. A larger groove may cause the IHS to warp under the socket load such that it does not
represent the performance of an ungrooved IHS on production packages.
Inspect parts for compliance to specifications before accepting from machine shop.
Figure 20. IHS Reference Groove on the FC-LGA4 Package
Figure 21. IHS Groove Orientation Relative to the LGA775 Socket
IHS Groove
Pin Indicator

Intel Celeron D Specifications

General

Processor Family	Intel Celeron D
Architecture	NetBurst
Number of Cores	1
Socket	LGA 775
FSB Speed	533 MHz
Operating Voltage	1.25V-1.4V
Virtualization Technology	No
Integrated Graphics	No
Core Name	Prescott
Core Stepping	D0
Clock Speed	3.6 GHz
L1 Cache	16 KB
Process Technology	90 nm
Instruction Set	SSE, SSE2, SSE3
L2 Cache	256 KB - 512 KB