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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

Thermal and Mechanical Design Guidelines 47

5.2.1.1 Random Vibration Test Procedure

Recommended performance requirement for a system:

Duration: 10 min/axis, 3 axes

Frequency Range: 5 Hz to 500 Hz

5 Hz @ .001 g2/Hz to 20 Hz @ 0.01 g2/Hz (slope up)

20 Hz to 500 Hz @ 0.01 g2/Hz (flat)

Power Spectral Density (PSD) Profile: 2.2 G RMS

Figure 5-2. Random Vibration PSD

Vibration System Level

0.0001

0.001

0.01

0.1

1 10 100 1000

+ 3 dB Control Limit

- 3 dB Control Limit

5.2.1.2 Shock Test Procedure

Recommended performance requirement for a system:

Quantity: 2 drops for + and - directions in each of 3 perpendicular axes (i.e., total

12 drops).

Profile: 25 G trapezoidal waveform

225 in/sec minimum velocity change. (systems > 20 lbm)

250 in/sec minimum velocity change. (systems < 20 lbm)

Setup: Mount sample system on tester.

Table of Contents3
Revision History9
Introduction11
Document Goals and Scope11
- Importance of Thermal Management11
- Document Goals11
- Document Scope12
References13
Definition of Terms13
Processor Thermal/Mechanical Information15
Mechanical Requirements15
- Processor Package15
- Figure 2-1. Package IHS Load Areas15
- Heatsink Attach17
Thermal Requirements18
- Processor Case Temperature18
- Thermal Profile19
- Figure 2-2. Processor Case Temperature Measurement Location19
- Tcontrol20
- Figure 2-3. Example Thermal Profile20
Heatsink Design Considerations21
- Heatsink Size22
- Heatsink Mass22
- Package IHS Flatness23
- Thermal Interface Material23
System Thermal Solution Considerations24
- Chassis Thermal Design Capabilities24
- Improving Chassis Thermal Performance24
- Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions24
- Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions24
- Summary25
System Integration Considerations25
Thermal Metrology27
Characterizing Cooling Performance Requirements27
- Example28
- Figure 3-1. Processor Thermal Characterization Parameter Relationships28
Processor Thermal Solution Performance Assessment29
Local Ambient Temperature Measurement Guidelines29
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink31
Processor Case Temperature Measurement Guidelines32
Thermal Management Logic and Thermal Monitor Feature33
Processor Power Dissipation33
Thermal Monitor Implementation33
- PROCHOT# Signal34
- Thermal Control Circuit34
- Thermal Monitor 235
- Figure 4-1. Thermal Monitor Control35
- Operation and Configuration36
- Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering36
- On-Demand Mode37
- System Considerations37
- Operating System and Application Software Considerations38
- THERMTRIP# Signal38
- Cooling System Failure Warning38
  - Digital Thermal Sensor38
  - Platform Environmental Control Interface (PECI)39
  - Figure 4-3. TCONTROL for Digital Thermal Sensor39
- Balanced Technology Extended (BTX) Thermal/Mechanical Design Information41
- Overview of the Balanced Technology Extended (BTX) Reference Design41
  - Target Heatsink Performance41
  - Acoustics42
  - Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance42
  - Table 5-2. Acoustic Targets43
  - Effective Fan Curve44
  - Voltage Regulator Thermal Management45
  - Figure 5-1. Effective TMA Fan Curves with Reference Extrusion45
  - Altitude46
  - Reference Heatsink Thermal Validation46
- Environmental Reliability Testing46
  - Structural Reliability Testing46
  - Table 5-3. VR Airflow Requirements46
  - Figure 5-2. Random Vibration PSD47
  - Figure 5-3. Shock Acceleration Curve48
  - Power Cycling49
  - Recommended Bios/Cpu/Memory Test Procedures49
- Material and Recycling Requirements49
- Safety Requirements50
- Geometric Envelope for Intel Reference BTX Thermal Module Assembly50
- Figure 5-4. Intel Type II TMA 65 W Reference Design50
- Preload and TMA Stiffness51
  - Structural Design Strategy51
  - TMA Preload Versus Stiffness51
  - Figure 5-5. Upward Board Deflection During Shock51
  - Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly Stiffness52
  - Table 5-4. Processor Preload Limits52
  - Figure 5-7. Thermal Module Attach Pointes and Duct-To-SRM Interface Features53
- ATX Thermal/Mechanical Design Information55
- ATX Reference Design Requirements55
- Figure 6-1. D60188-001Reference Design - Exploded View56
- Figure 6-2. E18764-001 Reference Design - Exploded View57
- Figure 6-3. Bottom View of Copper Core Applied by TC-1996 Grease57
- Validation Results for Reference Design58
  - Heatsink Performance58
  - Table 6-1. D60188-001 Reference Heatsink Performance58
  - Table 6-2. E18764-001 Reference Heatsink Performance58
  - Acoustics59
  - Table 6-3. Acoustic Results for ATX Reference Heatsink (D60188-001)59
  - Table 6-4. Acoustic Results for ATX Reference Heatsink (E18764-001)59
  - Altitude60
  - Heatsink Thermal Validation60
- Environmental Reliability Testing61
  - Structural Reliability Testing61
  - Figure 6-4. Random Vibration PSD61
  - Figure 6-5. Shock Acceleration Curve62
  - Power Cycling63
  - Recommended Bios/Cpu/Memory Test Procedures63
- Material and Recycling Requirements63
- Safety Requirements64
- Geometric Envelope for Intel Reference ATX Thermal Mechanical Design64
- Reference Attach Mechanism65
  - Structural Design Strategy65
  - Figure 6-6. Upward Board Deflection During Shock65
  - Mechanical Interface to the Reference Attach Mechanism66
  - Figure 6-7. Reference Clip/Heatsink Assembly66
  - Figure 6-8. Critical Parameters for Interfacing to Reference Clip67
  - Figure 6-9. Critical Core Dimension67
- Intel Quiet System Technology (Intel QST)69
- Intel QST Algorithm69
  - Output Weighting Matrix70
  - Proportional-Integral-Derivative (PID)70
  - Figure 7-1. Intel70
  - Figure 7-2. PID Controller Fundamentals71
- Board and System Implementation of Intel ® QST72
- Figure 7-3. Intel QST Platform Requirements72
- Figure 7-4. Example Acoustic Fan Speed Control Implementation73
- Intel ® QST Configuration and Tuning74
- Fan Hub Thermistor and Intel ® QST74
- Figure 7-5. Digital Thermal Sensor and Thermistor74
Appendix Alga775 Socket Heatsink Loading75
- LGA775 Socket Heatsink Considerations75
- Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design75
- Heatsink Selection Guidelines80
Appendix B Heatsink Clip Load Metrology81
- Overview81
- Test Preparation81
- Test Procedure Examples84
Appendix C Thermal Interface Management87
- Bond Line Management87
- Interface Material Area87
- Interface Material Performance87
Appendix D Case Temperature Reference Metrology89
- Objective and Scope89
- Supporting Test Equipment89
- Figure 7-11. Omega Thermocouple90
- Thermal Calibration and Controls91
- IHS Groove91
- D.4 IHS Groove91
- Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 O'clock Exit92
- Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 O'clock Exit (Old Drawing)93
- Figure 7-14. IHS Groove at 6 O'clock Exit on the 775-LAND LGA Package94
- Figure 7-15. IHS Groove at 6 O'clock Exit Orientation Relative to the LGA775 Socket94
- Thermocouple Attach Procedure95
- Thermocouple Wire Management108
- Figure 7-37. Thermocouple Wire Management108
Appendix E Legacy Fan Speed Control109
- Thermal Solution Design109
- Board and System Implementation111
- Combining Thermistor and On-Die Thermal Sensor Control115
- Interaction of Thermal Profile and T115
- Figure 7-43. On-Die Thermal Sensor and Thermistor115
- Table 7-3. FSC Definitions116
- Figure 7-44. FSC Definition Example117
- Table 7-4. ATX FSC Settings118
- Table 7-5. Balanced Technology Extended (BTX) Fan Speed Control Settings119
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations121
Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified122
Figure 7-46. Thermal Sensor Location Illustration123
Table 7-6. Fan Electrical Performance Requirements125
Appendix G Fan Performance for Reference Design125
Figure 7-47. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height128
Figure 7-48. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height128
Figure 7-49. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height128
Figure 7-61. Intel D60188-001 Reference Solution Assembly128
Figure 7-62. Intel D60188-001 Reference Solution Heatsink128
Figure 7-63. Intel E18764-001 Reference Solution Assembly128
Appendix Hmechanical Drawings128
- Reference Design146
- Table 7-7. Intel ® Representative Contact for Licensing Information of BTX146
- Table 7-8. D60188-001 Reference Thermal Solution Providers146
- Table 7-9. E18764-001 Reference Thermal Solution Providers147
- Table 7-10. Balanced Technology Extended (BTX) Reference Thermal Solution Providers148
Appendix I Intel Enabled Reference Solution Information146

Brand	Intel
Model	E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU
Category	Computer Hardware
Language	English

Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU User Manual

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Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU Specifications

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