9. Sawing/polishing sample preparation examples ............................................................... 32
9.1 PCB crosssectioning of a through hole............................................................................ 32
9.2 Example results............................................................................................................... 36
9.3 Slicing.............................................................................................................................. 37
9.3.1 Front face slicing ....................................................................................................... 37
9.3.2 Back face slicing........................................................................................................37
10. Useful hints.......................................................................................................................... 39
10.1 Recommended sample size ............................................................................................ 39
10.2 Diamond disc cutter......................................................................................................... 39
10.3 Diamond miller................................................................................................................. 39
10.3.1Surfacing of ductile materials and hard polymers...................................................... 39
10.4 Sample holders................................................................................................................ 40
11. Maintenance......................................................................................................................... 41
11.1 Replacing the fuse........................................................................................................... 41
11.2 Replacing the tubes of the peristaltic pump..................................................................... 41
Page 2 Operating Manual Leica EM TXP 10/10
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