Lenovo ThinkServer TS150 Product Guide

Memory
Lenovo DDR4 memory is compatibility tested and tuned for optimal ThinkServer performance and
throughput. From a service and support standpoint, Lenovo memory automatically assumes the system
warranty, and Lenovo provides service and support worldwide.
The TS150 server has four DIMM slots, and it supports DDR4 UDIMMs with ECC memory protection or
without ECC protection. The processor has two memory channels and supports two DIMMs per channel.
The following rules apply when selecting the memory configuration:
The TS150 server supports memory configurations with 1, 2, 3, or 4 UDIMMs.
Mixing ECC and non-ECC UDIMMs is not supported.
The TS150 server supports up to 2133 MHz memory speeds for one DIMM per channel and two
DIMMs per channel configurations, provided that the processors support this memory speed (see the
Processor options table in the Processors section for details).
The following table summarizes memory speeds and capacities that are supported by the TS150 server.
Table 3. TS150 maximum memory speeds and capacities
DIMMs per channel
UDIMM
Memory bus speed Maximum capacity
1 DPC 2133 MHz 32 GB (2x 16 GB)
2 DPC 2133 MHz 64 GB (4x 16 GB)
The following table lists the memory options that are available for the TS150 server.
Table 4. Memory options
Description Part number
Maximum
supported
Non-ECC UDIMMs
ThinkServer 4GB 1RX8 PC4-2133-U DDR4-2133 UDIMM 4X70G88312 4
ThinkServer 8GB 2RX8 PC4-2133-U DDR4-2133 UDIMM 4X70G88313 4
ThinkServer 16GB 2RX8 PC4-2133-U DDR4-2133 UDIMM 4X70G88314 4
ECC UDIMMs
ThinkServer 4GB 1RX8 PC4-2133-E CL15 DDR4-2133 ECC-UDIMM 4X70G88315 4
ThinkServer 8GB 2RX8 PC4-2133-E CL15 DDR4-2133 ECC-UDIMM 4X70G88316 4
ThinkServer 16GB 2RX8 PC4-2133-E CL15 DDR4-2133 ECC-UDIMM 4X70G88317 4
Internal storage
The TS150 server supports the following internal storage configurations:
1. 4x 3.5-inch + 1x 2.5-inch non-hot-swap drive bays + slim optical drive bay
2. 3x 3.5-inch + 1x 2.5-inch non-hot-swap drive bays + half high (HH) optical drive bay
3. 3x 3.5-inch + 1x 2.5-inch non-hot-swap drive bays + slim optical drive bay + ODD/backup drive bay
4. 2x 3.5-inch + 1x 2.5-inch non-hot-swap drive bays + HH optical drive bay + ODD/backup drive bay
Lenovo ThinkServer TS150 (Intel Xeon E3-1200 v5, Core i3, Pentium/Celeron G Series Processors) 9

Lenovo ThinkServer TS150 Specifications

General

Bus type	DMI3
Scalability	1S
Processor cache	8 MB
Processor cores	4
Processor model	E3-1225V5
System bus rate	8 GT/s
Processor series	Intel Xeon E3-1200 v5
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Execute Disable Bit	Yes
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor boost frequency	3.7 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	1
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
HDD size	3.5 \
RAID levels	0, 1, 5, 10
HDD interface	Serial ATA
Optical drive type	DVD-ROM
Total storage capacity	2000 GB
Maximum storage capacity	24 TB
Number of HDDs installed	2
Internal memory	8 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 8 GB
On-board graphics card ID	0x191D
On-board graphics card model	Intel® HD Graphics P530
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	400 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
PCI Express slots version	3.0
Operating altitude	0 - 3048 m
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	10 - 90 %
Operating relative humidity (H-H)	8 - 80 %
Power supply	400 W
Power supply input frequency	50 - 60 Hz
Redundant power supply (RPS) support	-
Chassis type	Tower
Operating system installed	Windows Server 2012 Foundation
Compatible operating systems	Windows Server 2012/2012 R2, Red Hat Enterprise Linux, SUSE Linux 11/12, Windows 10, Canonical Ubuntu 14.04, VMware vSphere 2015
Processor ARK ID	88168
Intel Secure Key Technology version	1.00
Intel® Hyper Threading Technology (Intel® HT Technology)	No

Weight and Dimensions

Depth	431 mm
Width	175 mm
Height	375 mm
Weight	12500 g