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Linear Technology LTC2983 - Package Description

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LTC2983
70
2983fc
For more information www.linear.com/LTC2983
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/product/LTC2938#packaging for the most recent package drawings.
LX48 LQFP 0113 REV A
0° – 7°
11° – 13°
0.45 – 0.75
1.00 REF
11° – 13°
9.00 BSC
A A
7.00 BSC
1
2
7.00 BSC
9.00 BSC
48
1.60
MAX
1.35 – 1.45
0.05 – 0.150.09 – 0.20
0.50
BSC
0.17 – 0.27
GAUGE PLANE
0.25
NOTE:
1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE
2. DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT
4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER
5. DRAWING IS NOT TO SCALE
SEE NOTE: 4
C0.30 – 0.50
R0.08 – 0.20
7.15 – 7.25
5.50 REF
1
2
5.50 REF
7.15 – 7.25
48
PACKAGE OUTLINE
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
SECTION A – A
0.50 BSC
0.20 – 0.30
1.30 MIN
LX Package
48-Lead Plastic LQFP (7mm × 7mm)
(Reference LTC DWG # 05-08-1760 Rev A)
e3
LTCXXXX
LX-ES
Q_ _ _ _ _ _
XXYY
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”