EasyManua.ls Logo

Omron ZX2 - Sensor Head

Omron ZX2
14 pages
Print Icon
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
ZX2
3
Sensor Head
47.47.5
mmmm
47.5
mm
35.5
mm
22.6
mm
* If the room temperature varies 1°C, the measured value varies 0.02% F.S.
(corr
esponding to 4µm for the Model ZX2-LD50)
* According to OMRON investigation of CMOS laser
displacement sensors performed in September 2010.
Cable can be
fed through
from the back
World smallest*
Compact sensor for easy mounting
IP67, robot cable
& temperature characteristic 0.02% F.S./°C
Reliable measurements in harsh environments
Spot beam
Precise measurement on
micro-scale objects
Line beam
Stable measurement on
rough-surfaced objects
Regular-reflective
Stable wafer
measurement
Measurement range
50
mm
±10
mm
Resolution
1.5µm
Linearity Line beam
±0.05%F.S.
*1
Spot beam
±0.10%F.S.
*1
Beam size Line beam
Approx.60µm×2.6mm
Spot beam
Approx.60µm dia.
ZX2-LD50L
Line beam type
ZX2-LD50
Spot beam type
Measurement range
100
mm
±35
mm
Resolution
m
Linearity Line beam
±0.05%F.S.
*2
Spot beam
±0.10%F.S.
*2
Beam size Line beam
Approx.110µm×2.7mm
Spot beam
Approx.110µm dia.
ZX2-LD100L
Line beam type
ZX2-LD100
Spot beam type
Measurement range
48
mm
±5
mm
Resolution
1.5µm
Linearity Spot
b
eam
±0.3%F.S.
Beam size Spot beam
Approx.60µm dia.
ZX2-LD50V
Spot beam type
*1 Using 40 to 50mm
*2 Using 65 to 100mm
(regular-reflective)
Sensor Heads for Various Applications-select
the Range and Type of Beam
New Regular-reflective Sensor Head Designed for Optimal Wafer Measurement
IP67 protection class enables to use the sensor in harsh
environments. A robot cable is used as standard between the
head and amplifier, that the unit can be used reliably on moving
parts. In addition, as 3D UV bond is used to fix the optical
components rather than screws, stress can be controlled and a
temperature characteristic 0.02% F.S./°C* is realized.
The world’s smallest CMOS laser displacement sensor
head is realized in a resin case. Enables to mount the
sensor in smallest spaces and to minimize measure-
ment errors arising from temperature fluctuations.

Related product manuals