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KX-F680BX/KX-F2681BX
■ PROCEDURE
1. Temporarily fix FLAT PACKAGE IC by soldering on two marked pins.
*Check accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using specified solder, in direction of arrow, by sliding the soldering iron.
■ MODIFICATION PROCEDURE OF BRIDGE
1. Re-solder slightly on bridged portion.
2. Remove remaining solder along pins using soldering iron as shown in below figure.
Soldering iron
bridge
Specified solder
Flux
Temporary soldering point.
■ PREPARATION
ESOLDER Sparkle Solder 115A-1, 115B-1
OR
Almit Solder KR-19, KR-19RMA
ESoldering iron Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 } 50 F (350 }10 )
(An expert may handle 60~80 W iron, but beginner might
damage foil by overheating.)
EFlux HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
°
HOW TO REPLACE FLAT PACKAGE IC
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