Quectel EC25-AUX

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 12 / 130
FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 76
FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 78
FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 78
FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 79
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ............... 114
FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................. 114
FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................. 116
FIGURE 45: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ............................................................... 117
FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 118
FIGURE 47: TOP VIEW OF THE MODULE .................................................................................................... 119
FIGURE 48: BOTTOM VIEW OF THE MODULE ............................................................................................ 119
FIGURE 49: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 121
FIGURE 50: TAPE AND REEL SPECIFICATIONS ........................................................................................ 123
FIGURE 51: TAPE AND REEL DIRECTIONS ................................................................................................ 123