LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 20 / 130
1.
1)
SD card, wireless connectivity and SGMII interfaces are not supported on ThreadX modules.
2.
2)
Within operation temperature range, the module is 3GPP compliant.
3.
3)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX
modules), etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum
and no harm to radio network. Only one or more parameters like P
out
might reduce in their value and
exceed the specified tolerances. When the temperature returns to normal operation temperature
levels, the module will meet 3GPP specifications again.
4. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of EC25 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
Firmware Upgrade USB interface or DFOTA*
RoHS All hardware components are fully compliant with EU RoHS directive
NOTES
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