Rockwell Automation PowerFlex 755 User Manual

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Device Modules

Device modules contain all of the logic to control the essential functions required by the device. For this DMAT example, we are

using the PowerFlex 753 / 755 HMI faceplate and AOI instruction which has preprogrammed start, stop, speed reference, Accel

and Decel times. This logic reduces the programming effort required by most applications providing more time for the

proprietary logic needed for the application.

Typically, the device module consists of a physical drive, but could also consist of a virtual or feedback-only axis. Device

modules can also consist of multiple devices, for example, a drive and perhaps a feedback device, for example, a sensor.

Device Module Tags

The application and individual device modules interact with each other via device specific control tags that include both

command and status information. The control tags consist of these data types.

All of the data types listed above can be modified to fit specific needs of your application. However, modifications to the data

types could have an impact on the device module and/or other preprogrammed logic, especially during import of additional

device modules.

For example, the UDT_ServoCtrl data type that is used by the integrated motion drives (CIP Motion and sercos interface based

drives) consists of these tags

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Rockwell Automation PowerFlex 755 Specifications

General

Frequency	50/60 Hz
Altitude	Up to 1000 m (3280 ft) without derating
Input Voltage	380-480V AC
Output Voltage	0-480V AC
Control Method	Vector Control, V/Hz Control
Communication Options	EtherNet/IP, ControlNet, DeviceNet
Enclosure Type	NEMA 1, NEMA 12
Cooling Method	Fan Cooled
I/O	Digital Inputs, Digital Outputs, Analog Inputs, Analog Outputs
Safety	Safe Torque Off (STO)
Protection Features	Overvoltage, Undervoltage, Overcurrent, Overtemperature
Ambient Temperature	0 to 40 °C (32 to 104 °F)
Storage Temperature	-40…70 °C (-40…158 °F)
Relative Humidity	5 to 95% non-condensing