Instrument Design and Function Description R&S CMU
1100.4903.82 3.14 E-5
TXDSP MODULE1
The sandwich TXDSP MODULE1 is directly plugged onto the DIGITAL
BOARD via two multipoint connectors. It contains the DSP on the
t
ransmitter side (TXDSP), which generates I/Q data according to the
application and provides them to the AUC MODULE1 via two 12-bit
D/A converters and several selection switches located on the DIGITAL
BOARD.
AUC MODULE1
The sandwich AUC MODULE1 is directly plugged onto the DIGITAL
BOARD via a multipoint connector and serves the purpose of filtering
the analog I/Q data from the TXDSP MODULE1 or the LINKHANDLER
MODULE depending on the position of the selection switches on the
DIGITAL BOARD according to the application (bandwidth shaping) and
converting it to the transmit IF (13.85 MHz) by means of an I/Q
modulator. Subsequently, the transmit IF is routed via the MMCX
connector (IF3TX1) on the DIGITAL BOARD to the RXTX BOARD1.
Extension
The DIGITAL BOARD can be extended by a further complete receive
and transmit channel consisting of ADC MODULE2, DDC MODULE2,
TXDSP MODULE2 and AUC MODULE2.
Option UNIVERSAL SIGNALLING UNIT R&S CMU-B21 Var02
The UNIV. SIGN. UNIT MODULE is the control and measurement module which contains all circuit
parts for signaling and measuring network-specific parameters.
To this end, the digital I/Q data from the DIGITAL BOARD are used on the receiver side (RX) in order to
calculate test parameters.
On the transmitter side, analog network-specific I/Q data are generated and provided to the AUC
MODULE1 on the DIGITAL BOARD.
Design
The UNIV. SIGN. UNIT MODULE is designed as plug-in module with
two aluminum shell covers. It is equipped with a screwed-on aluminum
cover both at the front and rear to allow for optimal electrical shielding
of the module.
Cooling system
The casing is provided with ventilation holes on the right and left in
order to produce a large cooling flow through the module by means of
the instrument fan.
This efficient cooling is necessary, since a great number of highly
integrated fast digital devices is used on the module and up to seven
sandwich modules can additionally be fitted so that the module is
densely packed.
Control and supply
The control, bus lines and voltage supply of the UNIV. SIGN. UNIT
MODULE are connected via two 96-pin VG multipoint connectors from
MOTHERBOARD1. Further interfaces for testing and debugging are
provided on the top of the module.
Function
As standard, the UNIV. SIGN. UNIT MODULE contains the three
sandwich boards DSP MODULE0, DSP MODULE1 and IQOUT
MODULE.
Besides, if a very high computing power is required, two further DSP
MODULES (DSP MODULE2, DSP MODULE3) and the SHARED
MEMORY can be fitted.
Furthermore, a slot for the Option R&S CMU-B52 SPEECH CODEC is
provided. This option includes DSP MODULE3.
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