Hardware Installation and Reference Guide    Preparing for Installation 
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  Too high temperatures can accelerate the aging of insulation materials, greatly reducing the reliability of the switch and severely 
affecting its service life.     
Temperature and Humidity  
0ºC to 45ºC (32ºF to 113ºF) 
10% to 90% (non-condensing) 
 
The ambient temperature and humidity of the switch are measured at the point that is 1.5 m (59.06 in.) above the floor and 0.4 
m (15.75 in.) before the switch rack when there is no protective plate in front or at the back of the rack 
2.2.3  Cleanliness Requirements   
Dust poses a major threat to the switch. The indoor dust takes on a positive or negative static electric charge when falling on the switch, 
causing poor contact of the metallic joint. Such electrostatic adhesion may occur more easily when the relative humidity is  low, not 
only affecting the service life of the switch, but also causing communication faults. The following table describes the requirements for 
the dust content and granularity in the equipment room. 
Dust particles (diameter ≥ 0.5 μm)   
Dust particles (diameter ≥ 5 μm) 
Apart from dust, the salt, acid, and sulfide in the air in the equipment room must meet strict requirements. These harmful substances 
will  accelerate  metal  corrosion  and  component  aging.  Therefore,  the  equipment  room  should  be  properly  protected  against  the 
intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide, nitrogen dioxide, and chlorine gas. 
 
The Average refers to the average limit of harmful gas in one week. The Maximum value is the upper limit of the harmful gas 
measured in one week for up to 30 minutes every day. 
2.2.4  Anti-interference Requirements 
The AP is susceptible to external interference by capacitive coupling, inductive coupling, electromagnetic waves, common impedance 
(ground) coupling, or conduction over power lines, signal lines and output lines. Note that: 
  In a TN earthing system, use a 3-wire single-phase outlet that has a protective earth (PE) contact to allow the filter circuit in the 
device to eliminate interference from the power grid. 
  The switch should be located far away from the large power radio launch pad, radar launch pad, and high-frequency large-current 
devices. 
  Use EMI shielding such as shielded interface cables to minimize interference when necessary. 
  Route  interface  cables  only  indoors  to  prevent  signal  ports  from  getting  damaged  by  overvoltage  or  overcurrent  caused  by 
lightning strikes.