SICK MPB10 - Page 4

7.1.1 Notes on the electrical installation......................................... 24
7.1.2 Wiring instructions................................................................... 24
7.2 Connections.............................................................................................. 26
7.2.1 Pin assignment/Connection diagram + wire colors.............. 26
7.3 Connecting the supply voltage................................................................. 26
8 Commissioning.................................................................................. 27
8.1 Overview of commissioning steps........................................................... 27
8.2 Put the sensor into operation for the first time...................................... 27
9 Operation............................................................................................ 28
9.1 General notes on operation..................................................................... 28
9.2 Alarm behavior (Index 4842)................................................................... 28
9.3 Vibration monitoring................................................................................. 31
9.3.1 Monitoring in time range......................................................... 31
9.3.2 Monitoring in frequency range (Index 4549-4582)............... 35
9.3.3 Readout of raw data................................................................ 40
9.4 Temperature monitoring (Index 4352-4355).......................................... 43
9.5 Shock detection (Index 4434-4448)....................................................... 43
9.6 Configuration of digital outputs............................................................... 44
9.7 Smart Task basic logic (A00)................................................................... 45
9.8 Device diagnostics (Index 4356-4370)................................................... 48
9.9 System-wide commands (Index 2)........................................................... 48
10 Process data structure..................................................................... 49
10.1 Byte 0 to 15............................................................................................... 49
10.2 Byte 18 and 19......................................................................................... 50
10.3 Process data profile (Index 120)............................................................. 51
11 Troubleshooting................................................................................. 52
12 Maintenance...................................................................................... 53
13 Decommissioning............................................................................. 54
13.1 Replace device.......................................................................................... 54
13.2 Disassembly and disposal....................................................................... 54
13.3 Returning devices..................................................................................... 54
14 Technical data.................................................................................... 55
14.1 Technical data........................................................................................... 55
14.2 Dimensional drawing................................................................................ 56
15 Annex.................................................................................................. 57
15.1 Conformities and certificates................................................................... 57
15.2 Index.......................................................................................................... 58
CONTENTS
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O P E R A T I N G I N S T R U C T I O N S | MPB10 8028041/2022-08-16 | SICK
Subject to change without notice