Technical specifications
Distributed I/O device 6DL2804-xxxxx
30 Hardware Installation Manual, 03/2014, A5E00378896F-03
Table 6- 2 Technical specifications 6DL2804-xMDxx / xMExx
Wall-mounted enclosure Type 6DL2804-0xxxx, DMT 02 ATEX E 249 U
Ex marking See Ex marking
Degree of protection
1)
IP54/IP55
Dimensions: W x H x D 650 x 450 x 230 950 x 450 x 230
Material Stainless steel: DIN 1.4404, plate thickness 1.5 mm
Weight [kg] 35 39
Cover seal Silicone rubber
Cable entries for
Voltage (cable-Ø in mm) 6 M25 (Ex e)
(9 to 12 )
Bus (cable-Ø in mm)
Signals (cable-Ø in mm) M32 (18 to 21) M32 (18 to 21)
3 / 1 row (1Mxxx) 6 9
5 / 2 rows (1Mxxx) 12 18
Equipotential bonding rail 3 x 10 mm Cu
Bonding terminals 0.75 to 35 mm² Ex e for equipotential bonding cable, 4 mm² for shield
connection
Protective conductor connector M6 screw, at least 16 mm²
Rated voltage/current
2)
These values depend on the installed components.
Operating temperature range
6DL2804-1xxxx with installation of
ET200iSP
-20° C to +xx °C
3)
Permissible humidity Max. 95%
1)
The degree of protection of the enclosure depends on that of the installed parts and the enclosure size.
2)
The actual electrical values depend on the electrical equipment installed. The manufacturer specifies the final values
within the framework of these limits.
3)
The specified permissible operating temperature range is only valid if the enclosure is installed horizontally. A vertical
installation can reduce the maximum permissible temperature (for information on this refer also to the ET200iSP
manual). The max. operating temperature is defined depending on the dissipated heat of the installed components, and
specified on the nameplate.
Note that the operating temperature of the complete setup must be checked again if further components are
subsequently fitted.
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