4 TECHNICAL DATA
The SmarAct logo on the back side of the external housing is opposite to the logo on the
cover glass of the METIRIO Readhead. This logo indicates the orientation of the readhead
with respect to the scale.
4.4.3 METIRIO Readhead Components
Figure 4.12: Components of the METIRIO package
The flip-chip package has the following features:
• The ceramic substrate is a circuit baord which provides connection for the interiror optoelec-
tronic components from the inside to the soldering pads on the bottom side.
• The robust frame ensures mechanical stability and can be used for mounting and handling
purposes.
• Venting slots at the sides of the frame ensure fast evacuation in UHV environments.
• An optically coated glass surface serves as imaging optic and comprises fiducial marks which
can be used for precision alignment.
All material components of the readhead have been carefully selected to fulfill the following
requirements:
• Non-magnetic,
• UHV-compatible (low outgassing according to NASA ASTM E595),
• RoHS compliant.
www.smaract.com | Page 37Metirio Encoder User Manual
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