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ST STM32H74xI/G User Manual

ST STM32H74xI/G
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Page #34 background image
Reference design AN4938
34/46 AN4938 Rev 4
8 Reference design
8.1 Reference design description
The reference design shown in Figure 18 is based on the STM32H753XI, a highly
integrated microcontroller that combines the ARM
®
Cortex
®
-M7 32-bit RISC core running at
up to 400 MHz with up to 2 Mbyte dual-bank Flash memory and 1 Mbytes of RAM (including
19
2 Kbytes of TCM RAM, 864 Kbytes of user RAM and 4 Kbytes of backup SRAM).
This reference design can be easy ported to othe
r devices. Specific requirements must be
respected for the following devices:
Devices featuring the SMPS: four additional pins must be used to supply the internal
SM
PS block (refer to the corresponding datasheet for more details).
Devices featuring a DSI internal regulator: four additional pins must be used to supply
the inte
rnal DSI regulator block (refer to the corresponding datasheet for more details).
8.1.1 Clocks
Two clock sources are used for the microcontroller:
LSE: X2– 32.768 kHz crystal for the embedded RTC.
HSE: X1– 25 MHz crystal.
Refer to Section 4: Clocks on page 21.
8.1.2 Reset
The reset signal of STM32H753XI device is low active and the reset sources include:
Reset button B1
Debugging Tools from JTAG/SWD connector CN15 and ETM trace connector CN12
Refer to Section 2.3: Reset and power supply supervisor on page 15.
8.1.3 Boot mode
Refer to Section 5: Boot configuration on page 25.
8.1.4 SWJ interface
Refer to Section 6: Debug management on page 28.
8.1.5 Power supply
Refer to Section 2: Power supplies on page 7.

Table of Contents

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ST STM32H74xI/G Specifications

General IconGeneral
BrandST
ModelSTM32H74xI/G
CategoryMicrocontrollers
LanguageEnglish

Summary

Introduction

Reference documents

1 General information

2 Power supplies

2.1 Introduction

Introduces the power supply aspects and considerations for STM32H7xx devices.

2.2 Power supply scheme

Outlines the overall power supply architecture, external connections, and decoupling.

2.3 Reset and power supply supervisor

Explains reset sources, power-on/down resets, and voltage supervisors.

3 Alternate function mapping to pins

4 Clocks

4.1 HSE oscillator clock

Covers High-Speed External oscillator clock options: bypass and crystal.

4.2 LSE oscillator clock

Describes Low-Speed External oscillator clock options: bypass and crystal.

4.3 Clock security system (CSS)

Explains the clock security system for detecting HSE and LSE clock failures.

5 Boot configuration

5.1 Boot mode selection

Details how to select boot modes using BOOT pin and option bytes.

5.2 Boot pin connection

Explains the external connection required for boot mode selection.

5.3 System bootloader mode

Describes the system bootloader and its communication peripherals.

6 Debug management

6.1 Introduction

Introduces the host/target interface and its components for debugging.

6.2 SWJ debug port (serial wire and JTAG)

Details the Serial Wire/JTAG Debug Port (SWJ-DP) and its interfaces.

6.3 Pinout and debug port pins

Discusses pin configurations related to debugging and debug ports.

7 Recommendations

7.1 Printed circuit board

Guidelines for PCB layout, layers, and grounding.

7.2 Component position

Recommendations for component placement to reduce EMI and cross-coupling.

7.3 Ground and power supply (VSS,VDD)

Best practices for ground and power supply routing and loop minimization.

7.4 Decoupling

Explains decoupling capacitor placement, types, and impedance considerations.

7.5 Other signals

Tips for managing other signals like noisy and sensitive signals for EMC.

7.6 Unused I/Os and features

Strategies for handling unused MCU resources to improve EMC performance.

8 Reference design

8.1 Reference design description

Describes the core components, clock sources, reset, boot mode, SWJ, and power supply of the reference design.

8.2 Component references

Lists mandatory and optional components used in the reference design.

9 Recommended PCB routing guidelines for STM32H74xl/G and STM32H75xl/G devices

9.1 PCB stack-up

Details different PCB layer stack-up configurations for impedance matching and EMC.

9.2 Crystal oscillator

Offers guidance on layout and routing of crystal oscillator circuits.

9.3 Power supply decoupling

Explains power supply decoupling best practices to prevent noise.

9.4 High speed signal layout

Guides on layout for high-speed signal integrity, including SDMMC, FMC, QUADSPI, ETM.

10 Conclusion

11 Revision history

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