ST STM32H74xI/G User Manual

Recommended PCB routing guidelines for STM32H74xI/G and STM32H75xI/G devices AN4938
38/46 AN4938 Rev 4
Figure 20. Six layer PCB stack-up example
9.2 Crystal oscillator
Use the application note: Oscillator design guide for STM8S, STM8A and STM32
microcontrollers (AN2867), for further guidance on how to layout and route crystal oscillator
circuits.
9.3 Power supply decoupling
An adequate power decoupling for STM32H74xI/G and STM32H75xI/G devices is
necessary to prevent an excessive power noise and ground bounce noise. Please refer to
Section 2.2: Power supply scheme.
The following recommendations
shall be followed:
• Place the decoupling capacitors as close as possible
to the power and ground pins of
the MCU. For BGA packages, it is recommended to place the decoupling capacitors on
the other side of the PCB (see Figure 21).
• Add the recommended decoupling capacitors for as many V
DD
/GND pairs as possible.
• Connect the decoupling capacitor pad to the power and ground plane with a wider,
sh
ort trace/via. This allows reducing the series inductance, maximizing the current flow
and minimizing the transient voltage drops from the power plane which also reduces
the possibility of ground bounce.
Figure 22 shows an example of decoupling capacitor placement underneath
STM32H74xI/G and STM32H75xI/G devices, closer
to the pins and with less vias.
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ST STM32H74xI/G Specifications

General

Brand	ST
Model	STM32H74xI/G
Category	Microcontrollers
Language	English