Supermicro X11SPM-F User Manual

26
X11SPL-F User's Manual
Attaching the Non-F Model Processor Carrier Assembly to the
Heatsink to Form the Processor Heatsink Module (PHM)
After you have made a processor carrier assembly by following the instructions on the
previous page, please follow the steps below to mount the processor carrier assembly onto
the heatsink to create the Processor Heatsink Module (PHM):
1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.
With your index nger pressing against the screw at this triangular corner, carefully hold
and turn the heatsink upside down with the thermal-grease side facing up. Remove the
protective thermal lm if present, and apply the proper amount of the thermal grease
as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)
2. Holding the processor carrier assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and
Heatsink
(Upside Down)
Non-Fabric CPU and Processor Clip
(Upside Down)
C
D
d
c
a
b
A
B
On Locations of (C, D), the notches
snap onto the heat sink’s
mounting holes
On Locations (A, B), the notches
snap onto the heatsink’s sides
A
B
D
C
Make sure Mounting
Notches snap into place
Triangle on the CPU
Triangle on the
Processor Clip
a larger hole at the diagonal corner
of the same (reverse) side of the
processor carrier assembly ("b" in
the graphic).
3. With the back of the heatsink and
the reverse side of the processor
carrier assembly facing up, align the
triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
carrier assembly.
4. Also align the triangular corner ("B")
at the diagonal side of the heatsink
with the corresponding clips on the
processor carrier assembly ("b").
5. Once the mounting clips on
the processor carrier assembly
are properly aligned with the
corresponding holes on the back
of the heatsink, securely attach the
heatsink to the processor carrier
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the processor
heatsink module (PHM).

Supermicro X11SPM-F Specifications

General

COM ports quantity	2
USB 2.0 ports quantity	6
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	5
Maximum LRDIMM memory	384 GB
Supported RDIMM clock speeds	1600, 1866, 2133, 2400, 2666 MHz
Supported RDIMM module capacity	4GB, 8GB, 16GB, 32GB
Supported DIMM module capacities	4GB, 8GB, 16GB, 32GB, 64GB, 128MB
Supported LRDIMM module capacity	32GB, 64GB
ECC	Yes
Memory voltage	1.2 V
Maximum RDIMM memory	192 GB
Supported memory types	DDR4-SDRAM
Maximum internal memory	768 GB
BIOS type	UEFI AMI
ACPI version	6.0
RAID levels	0, 1, 5, 10
Supported storage drive interfaces	SATA III
On-board graphics card model	Aspeed AST2500
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	0 - 60 °C
Storage relative humidity (H-H)	10 - 95 %
Operating relative humidity (H-H)	10 - 85 %
Processor socket	LGA 3647 (Socket P)
Processor manufacturer	Intel
Processor thermal power (max)	165 W
Processor number of cores supported	28
Wi-Fi	No
Number of SATA III connectors	12
PCI Express x16 (Gen 2.x) slots	0
Sustainability certificates	RoHS
Motherboard chipset	Intel® C621
Motherboard form factor	micro ATX
Harmonized System (HS) code	84733020

Weight and Dimensions

Width	243.8 mm