ZED-F9P-Integration Manual
UBX-18010802 - R01
5 Design Page 47 of 64
Objective Specification - Confidential
5.5.2 Package footprint, copper and solder mask
Copper and solder mask dimensioning recommendations for the ZED-F9P high precision receiver
packages are provided in this section. For all packages, the yellow color shows the copper (etch)
dimensions, the green color shows the solder mask opening dimensions and the red circles indicate
vias. Some PCB manufacturers prefer to adapt solder mask openings to their process tolerances.
The recommendations given in this section provide the nominal openings not including such
additional tolerances.
Paste mask recommendations are not provided as these are usually specifically related to the solder
paste in use as well as the particular reflow process.
Units below are in mm.
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