Xilinx Alveo U250 - Card Specifications; Design Flows

Card Specifications
Dimensions
Height: 4.376 inch (11.115 cm)
PCB thickness (±5%): 0.062 inch (0.157 cm)
Card length, passive heat sink: 9.2 inch (23.4 cm)
Card thickness with heat sink enclosure installed:
Passive: 1.44 inch (3.66 cm)
Note: A 3D model of this card is not available.
Environmental
Temperature
Operang: 0°C to +45°C
Storage: –25°C to +60°C
Humidity
10% to 90% non-condensing
Operating Voltage
PCIe
®
slot +12 V
DC
, +3.3 V
DC
, +3.3 V
AUXDC
, External +12 V
DC
Design Flows
The preferred opmal design ow for targeng the Alveo Data Center accelerator card uses the
Vis™ unied soware plaorm. However, tradional design ows, such as RTL or HLx are also
supported using the Vivado
®
Design Suite tools. The following gure shows a summary of the
design ows.
Chapter 1: Introduction
UG1289 (v1.1.1) November 20, 2019 www.xilinx.com
Alveo U200 and U250 Accelerator Cards 9
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