Xilinx SP605 User Guide

SP605 Hardware User Guide www.xilinx.com 13
UG526 (v1.1.1) February 1, 2010
Detailed Description
I/O Voltage Rails
There are four available banks on the XC6SLX45T-3FGG484 device. Banks 0, 1, and 2 are
connected for 2.5V I/O. Bank 3 is used for the 1.5V DDR3 component memory interface of
Spartan-6 FPGA’s hard memory controller. The voltage applied to the FPGA I/O banks
used by the SP605 board is summarized in Table 1-2.
References
See the Xilinx Spartan-6 FPGA documentation for more information at
http://www.xilinx.com/support/documentation/spartan-6.htm
.
2. 128 MB DDR3 Component Memory
There are 128 MB of DDR3 memory available on the SP605 board. A 1-Gb Micron
MT41J64M16LA-187E (96-ball) DDR3 memory component is accessible through Bank 3 of
the LX45T device. The Spartan-6 FPGA hard memory controller is used for data transfer
across the DDR3 memory interface's 16-bit data path using SSTL15 signaling. The
maximum data rate supported is 800 Mb/s with a memory clock running at 400 MHz.
Signal integrity is maintained through DDR3 resistor terminations and memory on-die
terminations (ODT), as shown in Table 1-3 and Table 1-4.
Table 1-2: I/O Voltage Rail of FPGA Banks
FPGA Bank I/O Voltage Rail
02.5V
12.5V
22.5V
31.5V
Table 1-3: Termination Resistor Requirements
Signal Name Board Termination On-Die Termination
MEM1_A[14:0] 49.9 ohms to V
TT
–
MEM1_BA[2:0] 49.9 ohms to V
TT
–
MEM1_RAS_N 49.9 ohms to V
TT
–
MEM1_CAS_N 49.9 ohms to V
TT
–
MEM1_WE_N 49.9 ohms to V
TT
–
MEM1_CS_N 100 ohms to GND –
MEM1_CKE 4.7K ohms to GND –
MEM1_ODT 4.7K ohms to GND –
MEM1_DQ[15:0] – ODT
MEM1_UDQS[P,N], MEM1_LDQS[P,N] – ODT
MEM1_UDM, MEM1_LDM – ODT
MEM1_CK[P,N]
100 ohm differential at
memory component
–
Notes:
1. Nominal value of V
TT
for DDR3 interface is 0.75V.

Xilinx SP605 Specifications

General

Brand	Xilinx
Model	SP605
Category	Motherboard
Language	English