9 Conditions of Acceptability
YASKAWA TOEP C710617 0SB YASKAWA AC Drive GA500 Installation Manual 31
2. Keep the ambient temperature lower than 35 °C (95 °F) in your application.
3. Keep the drive heatsink plate temperature lower than the maximum temperature
shown in Table 9.2 in your application.
Use U4-08 [Heatsink Temperature] to monitor the drive heatsink temperature.
Table 9.2 Maximum Temperature of the Heatsink Plate
Model Maximum Temperature of the Heatsink Plate
B001 - B012 90 °C (194 °F)
2001 - 2021 90 °C (194 °F)
2030 - 2070 80 °C (176 °F)
4001 - 4012 90 °C (194 °F)
4018 - 4038 80 °C (176 °F)
4. Make sure that the metal surface to which you will install the drive meets these
specifications:
• Flatness: ≤ 0.2 mm (0.0078 in)
• Roughness: ≤ 25 S
5. Make sure that there is sufficient space for wiring and airflow to cool the drive.
• 30 mm (1.18 in) minimum from each side
• 100 mm (3.94 in) minimum from top and bottom
6. The recommended thermal compound is X-23-7795 from Shin-Etsu Chemical Co.,
Ltd. Apply 100 μm to 250 μm of thermal compound over the full heatsink plate of
the drive.
7. Use the correct screws to safety the drive to a metal surface (enclosure panel). Table
9.3 shows the screw sizes and tightening torques.
Monitor the temperature of the external heatsink at the top center of the junction
between the external heatsink and the drive.
Table 9.3 Screw Sizes and Tightening Torques
Drive Model Screw Size
Tightening Torque
N∙m (lbf∙in)
B001 - B012 M5
2.0 - 2.5
(17.7 - 22.1)
2001 - 2021 M5
2.0 - 2.5
(17.7 - 22.1)
2030 - 2056 M5
2.0 - 2.5
(17.7 - 22.1)
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