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Chapter 1. Product FeaturesLynx User Manual
System
Processor
Support
(Skylake and next gen. CPU)
Fabric Interface, Skylake-F SKU CPU
CPU TDP
205W
UPI Speeds
10.4 GT/s, 9.6 GT/s
Socket Type
Socket P0 (LGA-3647 Socket)
System
Memory
6 x memory channels per CPU,
2 x DIMM per channel
24 x DIMM slots support:
DDR4 2400/2666MHz RDIMM/LRDIMM
(feature supports up to DDR4 2933MHz
by next gen. process upgrade)
- up to 384GB RDIMM SRx4
- up to 768GB RDIMM DRx4
- up to 3072GB RDIMM 3DS 8Rx4/QRx4
- up to 1536GB LRDIMM QRx4
- up to 3072GB LRDIMM 3DS 8Rx4//QRx4
(Apache Pass) support
Expansion
Slots
2 x AIC Max I/O® support:
PCIe Gen3 total 96 lanes;
(each 48 lanes from CPU0 & CPU1)
x16 (share with Max I/O®)
(optional by PCH C624/C622 SKUs), as 10GbE
(KR/SFI/XFI) or 1GbE (KX)
bracket) support SATA/PCIe x2
System BIOS
BIOS Type
Insyde UEFI BIOS
BIOS
Features
redirection
Mode
On-board
Devices
SATA
Intel® Lewisburg PCH on-chip solution
10 x SATA 6.0 Gb/s
BMC
Aspeed AST2500 Advanced PCIe Graphics &
Remote Management Processor
Serial over LAN
Network
Controller
port GbE RJ45 connectors
Mezzanine extension
for BMC dedicated management port
Graphics
Aspeed AST2500 Advanced PCIe Graphics &
Remote Management Processor
Input/Output
Serial ATA
10 x SATA 6.0 Gb/s ports
LAN
management
USB
2 x USB 3.0 Type-A connectors
2 x USB internal pin-header to support total
4 x USB3.0/USB2.0
1 x USB internal pin-header to support 2 x
USB 2.0
VGA
1 x external VGA port
1 x internal VGA pin-header
(share with external VGA port)
Serial Port
1 x external Micro-USB type B for COM port
2 x internal COM pin-headers
Others
1 x TPM 2.0 onboard
1.2 Specications