30 Rockwell Automation Publication 2198-UM004A-EN-P - October 2019
Chapter 2 Plan and Install the Kinetix 5100 Drive System
Electrical Noise Reduction
This section outlines best practices that minimize the possibility of noise-related
failures as they apply specifically to Kinetix 5100 system installations. For more
information on the concept of high-frequency (HF) bonding, the ground plane
principle, and electrical noise reduction, see the System Design for Control of
Electrical Noise Reference Manual, publication GMC-RM001
.
Bonding Drives
Bonding is the practice where you connect the metal chassis, assemblies, frames,
shields, and enclosures to reduce the effects of electromagnetic interference
(EMI).
Unless specified, most paints are not conductive and act as insulators. To achieve
a good bond between drive and the subpanel, surfaces must be paint-free or
plated. Bonding the metal surfaces creates a low-impedance return path for high-
frequency energy.
Improper bonding of the metal surfaces blocks the direct return path and allows
high-frequency energy to travel elsewhere in the cabinet. Excessive high-
frequency energy can affect the operation of other microprocessor controlled
equipment.
IMPORTANT To improve the bond between the drive and subpanel, construct your
subpanel out of zinc-plated (paint-free) steel.
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