Connect Tech Anvil - System Thermal Test Results

Anvil Embedded System
Users Guide
www.connecttech.com
Document: CTIM-00066
Revision: 0.00
Page 25 of 30
Date: 2023-04-05
System Thermal Test Results
The active cooling at full performance can meet or exceed the thermal margin requirements of the
Jetson AGX Orin™ when a full system benchmark is being performed at high ambient temperatures.
Airflow characteristics shown are all at maximum flow to create a linear control mode to measure
against. Dynamic fan control is available to use once a user’s system use case has been characterized to
provide a more refined control loop.
Test setup:
- Jetson 32GB 8 core production module.
- MAXN performance mode
- jetson_clocks –fan (all CPU/Mem/GPU/Fan clocks set to max)
- CPU stress (6 of 8 cores 100% utilization)
- gpu_burn with tensor cores (100% utilization using 1 CPU core to control)
- NVMe 1TB Samsung 970 running Disks Benchmark (100% utilization - using 1 CPU core to control)
- 10G Loopback fully linked
- 1G Loopback fully linked
- USB keyboard/mouse – no load
- DisplayPort 4k display
Internal System Reading locations
Value
Units
Ambient intake air temp (fans max speed – 8 m/s)
52
°C
Jetson AGX Orin™ internal die temp reading (power GUI – max is 99C)
69.2
°C
Jetson AGX Orin™ reading top of case (max is 80C)
61.4
°C
Active Cooling Maximum Airflow operation.