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General| Build Volume | 300 x 300 x 400 mm |
|---|---|
| Layer Resolution | 0.1-0.4 mm |
| Nozzle Diameter | 0.4 mm |
| Filament Diameter | 1.75 mm |
| Connectivity | SD card, USB |
| Supported Materials | PLA, ABS, PETG, TPU |
| Printing Technology | FDM (Fused Deposition Modeling) |
| Display | LCD screen |
| Bed Leveling | Manual |
| Power Supply | 110V / 220V |
| Frame Structure | Aluminum |
| Bed Temperature | Up to 100°C |
| Nozzle Temperature | Up to 250°C |
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