Chapter 5 Specifications
Technical Specifications
Energy Efficient CPU/GPU
Low-power Intel Atom 3845 (Bay Trail-I) processor with 4-cores @ 1.91 GHz (one thread per
core), Silvermont microarchitecture, 2 MB L2-cache, low-power ultra-mobile class 22 nm System
on Chip (SoC), support for Intel Virtualization Technology (Intel VT-x), Intel Enhanced
SpeedStep
®
Technology, Intel 64, 64-bit instruction set Integrated
Integrated Intel HD GPU: 7
th
generation Intel graphics and media encode/decode engine with four
Intel execution units (EUs), supports DirectX 11, OGLES 2.0, OGL 3.2; operates at 542 MHz
base frequency and 792 MHz burst frequency; video decode/encode to H.264/MPEG2
Open-architecture COM module-based, optimized for energy-efficient SoC designs
RAM memory: 4 GB DDR3 with ECC
Storage
Internal mSATA / microSD card slots on carrier board or removable 2.5” SATA SSD in add-on
storage module
Modular/Expandable
Up to 3x Mini-PCIe I/O card slots pre-routed to 79 spare pins on circular connectors for add-on
I/O modules
I/O integration services available for turnkey solutions
Pre-integrated I/O configurations by special order, i.e. 1553, ARINC 429, more
serial/USB/Ethernet ports
Target Applications
Civil and military tactical mission processing (server/ computer) in ground vehicle, fixed wing or
rotary aircraft, maritime vessels, outdoor, underground, other demanding embedded computing
platforms
Extending energy-efficient, high-performance, multi-core Intel x86 computing architecture into
embedded computing applications with harsh temperature, shock, vibration, altitude, dust, water
environmental and EMI conditions
SWaP-constrained mobile, tactical, airborne, vehicle, and sensor processing, including new
builds and retrofit (C4ISR technology refresh) upgrades
Commercial and military aerospace platforms requiring compliance to MIL-STD-810G, MIL-STD-
461F, MIL-STD- 1275D, MIL-STD-704F, CE Mark, RTCA/DO-160
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