Dell D19M - Advantages of HDMI; Memory Features; Verifying System Memory; Verifying System Memory in Setup

Key Specifications
The following table lists the specifications' comparison between DDR3 and DDR4:
Table 4. DDR3 vs DDR4
Feature/Option DDR3 DDR4 DDR 4 Advantages
Chip Densities 512 Mb-8 Gb 4 Gb-16 Gb Larger DIMM capacities
Data rates 800 Mb/s-2133 Mb/s 1600 Mb/s-3200 Mb/s Migration to higher speed I/O
Voltage 1.5 V 1.2 V Reduced memory power
demand
Low voltage standard Yes (DDR3L at 1.35V) Anticipated at 1.05V Memory Power Reductions
Internal banks 8 16 Higher data rates
Bank groups (BG) 0 4 Faster burst accesses
VREF inputs 2 —DQs and CMD/ADDR 1 — CMD/ADDR VREFDQ Now Internal
tCK — DLL Enabled 300 Mhz-800 Mhz 667Mhz-1.6Ghz Higher data rates
tCK — DLL Disabled 10MHz – 125MHz (optional) Undefined to 125MHz DLL-off now fully supported
Read Latency AL+CL AL+CL Expanded values
Write Latency AL+CWL AL+CWL Expanded values
DQ Driver (ALT) 40&Omega 48&Omega Optimal for PtP Applications
DQ Bus SSTL15 POD12 Less I/O Noise and Power
RTT Values (in &Omega) 120,60,40,30,20 240,120,80,60,48,40,34 Support for higher data rates
RTT not allowed READ Bursts Disables during READ Bursts Ease of use
ODT Modes Nominal, Dynamic Nominal, Dynamic,Park Add’l Control Mode; OTF
Value Change
ODT Control ODT Signaling Required ODT Signaling Not Required Ease of ODT Control; Allows
Non-ODT Routing, PtP Apps
Multi-Purpose Register Four Registers – 1 Defined, 3
RFU
Four Registers – 3 Defined, 1
RFU
Provides Additional Specialty
Readout
DIMM Types RDIMM, LRDIMM, UDIMM,
SODIMM
RDIMM, LRDIMM, UDIMM,
SODIMM
DIMM Pins 240 (R, LR, U); 204
(SODIMM)
288 (R, LR, U); 260
(SODIMM)
RAS ECC CRC, Parity, Addressability,
GDM
More RAS features; improved
data integrity
DDR4 Details
There are subtle differences between DDR3 and DDR4 memory modules, as listed below.
Key notch difference
The key notch on a DDR4 module is in a different location from the key notch on a DDR3 module. Both notches are on the
insertion edge, but the notch location on the DDR4 is slightly different, to prevent the module from being installed into an
incompatible board or platform.
Technology and components
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