Design recommendations Minimum connection diagram
Digi XBee3 Cellular LTE-M Global Smart Modem User Guide
65
3. Place sufficient bulk capacitance on the XBee VCC pin to maintain voltage above the minimum
specification during transmissions. Power consumption lists the peak current during
transmitting.
4. Place smaller high frequency ceramic capacitors very close to the XBee Smart Modem VCC pin
to decrease high frequency noise.
5. Use a wide power supply trace or power plane to ensure it can handle the peak current
requirements with minimal voltage drop. The supply should be inside the supply voltage
operating range at startup and should not be allowed to droop lower than 3.2 V during
operation.
Minimum connection diagram
In high EMI noise environments, we recommend adding a 10 nF ceramic capacitor very close to pin 5.
Heat considerations and testing
The XBee Smart Modem may generate significant heat during sustained operation. In addition to
heavy data transfer, other factors that can contribute to heating include ambient temperature, air
flow around the device, and proximity to the nearest cellular tower (the XBee Smart Modem must
transmit at a higher power level when communicating over long distances). Overheating can cause
device malfunction and potential damage.
The XBee Smart Modem must not be operated in ambient temperatures exceeding 85 °C. Additionally,
if you expect to operate the product above 70 °C, we recommend that you perform an analysis of your
application to characterize the self-heating of the XBee device:
1. Set up the device in the typical operating scenario you plan to use it in.
2. Monitor the device temperature using TP (Temperature) until it reaches a steady state.
3. Convert the returned value from hex format to decimal.
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