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Build Volume | 220x220x280mm |
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Layer Resolution | 0.1-0.4 mm |
Nozzle Diameter | 0.4 mm |
Filament Diameter | 1.75 mm |
Connectivity | SD card, USB |
Bed Leveling | Automatic |
Max Nozzle Temperature | 260°C |
Max Bed Temperature | 100°C |
Display | 4.3-inch touch screen |
Supported Filaments | PLA, ABS, TPU, PETG |
Power Supply | 350W |
Frame Material | Aluminum |
Steps for updating the screen firmware, including disassembly and TF card insertion.
Instructions for updating the motherboard firmware, including TF card insertion and reboot.
Recommendations for hot end and hot bed temperatures for optimal leveling accuracy.
Details on board firmware updates, including bug fixes and new features like Z-offset saving.
Information on viewing motherboard and screen firmware versions via the 'About Machine' menu.