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Build Volume | 320 x 320 x 400 mm |
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Nozzle Diameter | 0.4 mm |
Print Speed | 30-180 mm/s |
Filament Diameter | 1.75 mm |
Connectivity | USB, SD Card |
Bed Leveling | Automatic |
Technology | FDM |
File Format | STL, OBJ, AMF |
Max Nozzle Temperature | 260°C |
Max Bed Temperature | 100°C |
Display | 4.3-inch Touchscreen |
Supported Filaments | PLA, ABS, PETG, TPU |
Power Supply | 24V |