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Fibocom L850-GL Series User Manual

Fibocom L850-GL Series
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FIBOCOM L850-GL Series Hardware Guide Page 34 of 59
3.4.1.2 PCIe Interface Application
The reference circuit is shown in Figure 3-13:
Module side
AP side
AC Caps
AC Caps
PERST#
CLKREQ#
WAKE#
PERST#(pin50)
CLKREQ#(pin52)
PEWAKE#(pin54)
PERn0
PERP0
PETn0
PETP0
REFCLKN
REFCLKP
PETn0(pin41)
PETP0(pin43)
PERn0(pin47)
PERP0(pin49)
REFCLKN(pin53)
REFCLKP(pin55)
+3.3V/1.8V
100K 10K
M.2 Key-B 75pin
Connector
Figure 3-13 Reference circuit for PCIe interface
L850 module supports PCIe Gen1 interface, one lane. The PCIe interface including three differential pairs:
transmit pair TXP/N, receiving pair RXP/N and clock pair CLKP/N.
PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in
PCB Layout:
The differential signal pair lines should be parallel and equal in length;
The differential signal pair lines should be short if possible and be controlled within 15 inch (380 mm)
for AP end;
The impedance of differential signal pair lines is recommended to be 100Ω, and can be controlled to
80~120Ω in accordance with PCIe protocol;
Try to avoid the discontinuous reference ground, such as segment and space;
When the differential signal lines go through different layers, the via hole of grounding signal should
be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes
and the lines should never cross the segment of plane;
Try to avoid bended lines and avoid introducing common-mode noise in the system, which will
influence the signal integrity and EMI of difference pair. As shown in Figure 3-14, the bending angle
of all lines should be equal or greater than 135°, the spacing between difference pair lines should be
larger than 20mil, and the line caused by bending should be greater than 1.5 times line width at least.
When a serpentine line is used for length match with another line, the bended length of each segment

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Fibocom L850-GL Series Specifications

General IconGeneral
CategoryGSM/GPRS Modules
ModelL850-GL
Form FactorM.2
Operating Temperature-10°C to +55°C
Storage Temperature-40°C to +85°C
GSM Bands850/900/1800/1900MHz
GNSSGPS, GLONASS, BeiDou, Galileo
InterfaceUSB 2.0, UART, PCM, I2C, GPIO
Operating Voltage3.135V to 4.4V
LTE FDDB1, B2, B3, B4, B5, B7, B8, B12, B13, B17, B18, B19, B20, B25, B26, B28, B29, B30, B66
LTE TDDB38/B39/B40/B41
WCDMAB1, B2, B4, B5, B8
AT Command Set3GPP TS 27.007
CertificationsCE, FCC, GCF, PTCRB