Frick RWB II Plus - Table of Contents

RWB II PLUS MICROPROCESSOR CONTROL
OPERATION - MAINTENANCE
S70-200 OM
Page 2
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Contents
MICROPROCESSOR CONTROL PANEL ....................................................................................................................................3
KEYS AND KEY FUNCTIONS ......................................................................................................................................................4
TO CHANGE THE ADJUSTABLE SETPOINTS:........................................................................................................................... 6
HOW TO DETERMINE ADJUSTABLE SETPOINTS: ...................................................................................................................7
TEMPERATURE-PRESSURE CONTROL PROGRAM (OPTION) .............................................................................................10
LEAD-LAG OPTION....................................................................................................................................................................12
COMMUNICATIONS TROUBLESHOOTING ..............................................................................................................................13
HOW THE MICROPROCESSOR WORKS - SUMMARY - .......................................................................................................... 13
MULTIPLE COMPRESSOR SEQUENCING ...............................................................................................................................14
SUGGESTED PROGRAMMABLE CONTROLLER PROGRAM TO DECODE
MICROPROCESSOR OUTPUT DATA CODES ...................................................................................................................14
MICROPROCESSOR OUTPUT DATA CODE............................................................................................................................. 15
MICROPROCESSOR TELECOMMUNICATIONS ......................................................................................................................16
COMMUNICATIONS PROTOCOL SPECIFICATIONS:...............................................................................................................16
TROUBLESHOOTING THE RWB II PLUS MICROPROCESSOR..............................................................................................20
GENERAL INFORMATION ......................................................................................................................................................... 20
TROUBLESHOOTING FRICK SBC MICROPROCESSOR SYSTEM ........................................................................................20
TESTING MICRO-PANEL ALARMS/CUTOUTS .........................................................................................................................23
EPROM MEMORY I/C CHIP REPLACEMENT ...........................................................................................................................25
SBC BOARD REPLACEMENT ...................................................................................................................................................25
MICROPROCESSOR DISPLAY REPLACEMENT...................................................................................................................... 25
OUTPUT FUSE REPLACEMENT ...............................................................................................................................................25
SBC WIRING DIAGRAM.............................................................................................................................................................26
POINT-TO-POINT FIELD WIRING DIAGRAM ............................................................................................................................26
MICRO COMPONENT PLACEMENT DIAGRAM .......................................................................................................................27
RWB II PLUS TELECOMMUNICATIONS ...................................................................................................................................27
MICROPANEL ASSEMBLY WIRING DIAGRAMS.......................................................................................................................28
RECOMMENDED SPARE PARTS - CURRENT DESIGN ..........................................................................................................32