HP Pro 3330 Microtower User Manual

Appendix C Backup and Recovery .............................................................................................................. 185
Restoring and recovering in Windows 7 ........................................................................................... 185
System Restore ............................................................................................................... 185
System Recovery ............................................................................................................. 185
System Recovery when Windows is responding ............................................ 186
System Recovery when Windows is not responding ...................................... 187
System recovery using recovery media .......................................................... 187
Creating recovery media ................................................................ 188
Using recovery media ..................................................................... 189
Backup and recovery in Windows 8 ................................................................................................. 190
Backing up your information ............................................................................................ 190
Performing a system recovery ......................................................................................... 191
Using the Windows recovery tools .................................................................. 191
Using f11 recovery tools .................................................................................. 192
Using Windows 8 operating system media (purchased separately) ............... 192
Appendix D Power Cord Set Requirements ................................................................................................ 193
General Requirements ..................................................................................................................... 193
Japanese Power Cord Requirements .............................................................................................. 193
Country-Specific Requirements ........................................................................................................ 194
Appendix E POST Error Messages .............................................................................................................. 195
POST Numeric Codes and Text Messages ..................................................................................... 196
Interpreting POST Diagnostic Front Panel LEDs and Audible Codes .............................................. 204
Appendix F Password Security and Resetting CMOS ................................................................................ 208
Resetting the Password Jumper ...................................................................................................... 209
Clearing and Resetting the CMOS ................................................................................................... 209
Appendix G Specifications ........................................................................................................................... 211
MT Specifications ............................................................................................................................. 211
SFF Specifications ........................................................................................................................... 212
Index ................................................................................................................................................................. 213
ix

HP Pro 3330 Microtower Specifications

General

Product type	PC
Motherboard chipset	Intel® H61
Tcase	65.3 °C
Bus type	DMI
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-3220
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor socket	LGA 1155 (Socket H2)
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8
Thermal Design Power (TDP)	55 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	33
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1333 MHz
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 4 GB
HDD size	3.5 \
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Number of SSDs installed	0
Cooling type	-
On-board graphics card ID	0x152
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Recovery operating system	Windows 8 Pro
Operating system installed	Windows 7 Professional
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Processor ARK ID	65693
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal solution specification	PCG 2011C
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00
Power supply	300 W
Power supply input voltage	100 - 240 V
Power supply input frequency	50 - 60 Hz

Weight and Dimensions

Depth	421.1 mm
Width	173.2 mm
Height	382.3 mm
Weight	10000 g